Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/29/2008
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Application #:
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11133009
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Filing Dt:
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05/18/2005
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Publication #:
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Pub Dt:
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11/23/2006
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Inventors:
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James P. Mellody, Sabina J. Houle
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Title:
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METHOD OF BONDING A MICROELECTRONIC DIE TO A SUBSTRATE AND ARRANGEMENT TO CARRY OUT METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95052 |
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| BLAKELY, SOKOLOFF, TAYLOR & ZAFMAN LLP |
| ATTN: LALEH JALALI |
| 12400 WILSHIRE BOULEVARD |
| SEVENTH FLOOR |
| LOS ANGELES, CA 90025 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| THE RAINBOW CITY OFFICE BUILDING, 68 QINGHE MIDDLE STREET HAIDIAN DISTRICT |
| BEIJING, CHINA 100085 |
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| CPA GLOBAL LTD |
| LIBERATION HOUSE |
| CASTLE STREET |
| ST HELIER, JE1 1BL JERSEY |
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