Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/29/2008
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Application #:
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11233578
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Filing Dt:
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09/22/2005
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Publication #:
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Pub Dt:
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11/30/2006
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Inventors:
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Chun-Tiao Liu, Da-Jung Chen, Chun-Liang Lin, Jeng-Jen Li, Chau Chun Wen, Cheng Chieh Hsu
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Title:
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POWER MODULE PACKAGE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2, R&D 2ND RD., SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, 300, TAIWAN R.O.C. |
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THOMAS D. FOSTER, ESQ. |
GENUS LAW GROUP |
12760 HIGH BLUFF DRIVE |
SUITE 300 |
SAN DIEGO, CALIFORNIA 92130 |
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