Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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07/14/2009
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Application #:
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11160015
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Filing Dt:
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06/06/2005
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Publication #:
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Pub Dt:
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12/07/2006
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Inventors:
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Scott D. Brandenburg, Bruce A. Myers
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Title:
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CIRCUIT ASSEMBLY WITH SURFACE-MOUNT IC PACKAGE AND HEAT SINK
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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P. O. BOX 9005 |
ONE CORPORATE CENTER CT10C |
KOKOMO, INDIANA 464904-9005 |
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HARTMAN & HARTMAN, P.C. |
552 EAST 700 NORTH |
VALPARAISO, IN 46383 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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ERIN COURT, BISHOP'S COURT HILL |
ST. MICHAEL, BARBADOS |
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DELPHI TECHNOLOGIES IP LIMITED |
5825 INNOVATION DRIVE |
LEGAL STAFF - M/C 480-415-154 |
TROY, MI 48098 |
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