Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11147756
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Filing Dt:
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06/08/2005
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Publication #:
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Pub Dt:
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12/14/2006
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Inventors:
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Emmievel S. Anacleto, Mark Henry Antiporta, Fernando V. Capinig, Mizpa B. Mijares
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Title:
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Plastic integrated circuit package, leadframe and method for use in making the package
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ELECTRONICS AVENUE |
| FTI COMPLEX |
| TAGUIG, PHILIPPINES |
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| LESLIE L. KASTEN, JR. [600952-3US] |
| 2005 MARKET STREET |
| SUITE 2200/ONE COMMERCE SQUARE |
| PHILADELPHIA, PA 19103-7013 |
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