Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11192651
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Filing Dt:
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07/29/2005
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Publication #:
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Pub Dt:
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12/21/2006
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Inventors:
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Chun-Tiao Liu, Da-Jung Chen, Jeng-Jen Li, Chun-Liang Lin, Chau Chun Wen
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Title:
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Method for preventing the overflowing of molding compound during fabricating package device
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2, R&D 2ND RD. |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, 300, TAIWAN R.O.C. |
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| GENUS LAS GROUP |
| THOMAS D. FOSTER, ESQ. |
| 12760 HIGH BLUFF DRIVE, SUITE 300 |
| SAN DIEGO, CA 92130 |
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