Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11454740
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Filing Dt:
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06/16/2006
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Publication #:
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Pub Dt:
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12/21/2006
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Inventors:
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Michael Heiden, Erwin Thiel, Christof Krampe-Zadler
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Title:
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Method of optically imaging and inspecting a wafer in the context of edge bead removal
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ERNST-LEITZ-STRASSE 17-37 |
| WETZLAR, GERMANY D-35578 |
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| ROBERT P. SIMPSON |
| SIMPSON & SIMPSON, PLLC |
| 5555 MAIN STREET |
| WILLIAMSVILLE, NY 14221 |
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