Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/03/2009
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Application #:
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11464779
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Filing Dt:
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08/15/2006
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Publication #:
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Pub Dt:
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12/28/2006
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Inventors:
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Anthony A. Primavera, Vijesh Unnikrishnan, David J. Smith
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Title:
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FLIP CHIP DIE ASSEMBLY USING THIN FLEXIBLE SUBSTRATES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4100 HAMLINE AVENUE NORTH |
| ST. PAUL, MINNESOTA 55112 |
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| LISA JOHNSON |
| 90 SOUTH SEVENTH STREET |
| 2200 WELLS FARGO CENTER |
| MINNEAPOLIS, MN 55402-3901 |
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