Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11201682
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Filing Dt:
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08/11/2005
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Publication #:
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Pub Dt:
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01/11/2007
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Inventor:
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Valery R. Marinov
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Title:
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Multi-layered substrate assembly with vialess electrical interconnect scheme
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1301 12TH AVENUE NORTH |
| FARGO, NORTH DAKOTA 58105 |
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| JAMES L. JOHNSON |
| 3151 S. VAUGHN WAY, SUITE 411 |
| AURORA, CO 80014 |
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