Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11428795
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Filing Dt:
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07/05/2006
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Publication #:
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Pub Dt:
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01/11/2007
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Inventors:
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KWANG JAE OH, JE HONG SUNG, JIN WAUN KIM
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Title:
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SEMICONDUCTOR MULTI-CHIP PACKAGE WITH A SPACER BETWEEN A CHIP AND THE SUPPORTING SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 314 MAETAN-3-DONG, YOUNGTONG-KU, SUWON |
| KYUNGKI-DO, KOREA, REPUBLIC OF |
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| LOWE HAUPTMAN AND BERNER |
| 1700 DIAGONAL ROAD |
| SUITE 300 |
| ALEXANDRIA, VA 22314 |
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