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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
11180255
Filing Dt:
07/13/2005
Publication #:
Pub Dt:
01/18/2007
Inventors:
Rich F. Schiferl, Michael J. Melfi, Qimin J. Dong
Title:
Lamination stack cooling path
Assignment: 1
Reel/Frame:
016779/0224Recorded: 07/13/2005Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/29/2005
Exec Dt:
04/29/2005
Exec Dt:
04/29/2005
Assignee:
1 ALLEN-BRADLEY DRIVE
MAYFIELD HEIGHTS, OHIO 44124
Correspondent:
ALEXANDER M. GERASIMOW
ALLEN-BRADLEY COMPANY, LLC
PATENT DEPT./704, FLOOR 8 T-29
1201 SOUTH SECOND STREET
MILWAUKEE, WISCONSIN 53204-2496
Assignment: 2
Reel/Frame:
019312/0529Recorded: 05/18/2007Pages: 93
Conveyance:
SECURITY AGREEMENT
Assignor:
Exec Dt:
01/31/2007
Assignee:
787 SEVENTH AVENUE
THE EQUITABLE TOWER
NEW YORK, NEW YORK 10019
Correspondent:
MILBANK, TWEED, HADLEY & MCCLOY LLP
ONE CHASE MANHATTAN PLAZA
RM. 4640
NEW YORK, NY 10005

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