Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11182794
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Filing Dt:
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07/18/2005
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Publication #:
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Pub Dt:
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01/18/2007
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Inventors:
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Kuan-Jen Chung, Fu-Yao Yang, Williams Tsau, Chih-Hao Lin, Kun-Yu Lai
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Title:
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Method for dicing a semiconductor wafer
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 5, DALI 3RD RD., TAINAN SCIENCE-BASED INDUSTRIAL PARK, CHAN-HUA |
CHEN, TAINAN HSIEN, TAIWAN |
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STEPHEN A. BENT |
FOLEY & LARDNER LLP |
WASHINGTON HARBOUR |
3000 K STREET, N.W., SUITE 500 |
WASHINGTON, D.C. 20007-5143 |
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