Patent Assignment Abstract of Title
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Total Assignments:
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Patent #:
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Issue Dt:
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02/05/2008
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Application #:
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11180448
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Filing Dt:
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07/13/2005
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Publication #:
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Pub Dt:
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01/18/2007
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Inventors:
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Jong-Ning Aoh, Cheng-Li Chuang
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Title:
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METHOD OF REALIZING THERMOSONIC WIRE BONDING BETWEEN METAL WIRES AND COPPER PADS BY DEPOSITING A THIN FILM TO SURFACE OF SEMICONDUCTOR CHIP WITH COPPER PADS
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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160 SAN-HSING, MIN-HSIUNG |
CHIA-YI 621, TAIWAN R.O.C. |
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ARLEN L. OLSEN |
SCHMEISER, OLSEN & WATTS |
3 LEAR JET LANE |
SUITE 201 |
LATHAM, NY 12110 |
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