Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11525428
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Filing Dt:
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09/22/2006
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Publication #:
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Pub Dt:
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01/25/2007
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Inventors:
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Chintamani Palsule, Jay Meyer, John H. Stanback, Jeremy A. Theil, Kirk A. Lindahl et al
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Title:
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Method for fabricating low leakage interconnect layers in integrated circuits
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| UNIT LEVEL 13 MAIN OFFICER TOWER |
| FINANCIAL PARK LABUAN JALAN, MERDEKA |
| LABUAN, MALAYSIA 87000 |
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| KENNETH N. NIGON |
| 1235 WESTLAKES DRIVE, SUITE 301 |
| RATNERPRESTIA |
| BERWYN, PA 19312 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| WALKER HOUSE, 87 MARY STREET |
| GEORGE TOWN |
| GRAND CAYMAN, CAYMAN ISLANDS KY1-9002 |
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| KENNETH N. NIGON |
| 1235 WESTLAKES DRIVE, SUITE 301 |
| RATNERPRESTIA |
| BERWYN, PA 19312 |
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