Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10538402
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Filing Dt:
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07/21/2006
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Publication #:
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Pub Dt:
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02/22/2007
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Inventors:
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Hui Wang, Voha Nuch
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Title:
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Measuring alignment between a wafer chuck and polishing/plating receptacle
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4378 ENTERPRISE STREET |
| FREMONT, CALIFORNIA 94538 |
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| PETER J. YIM |
| MORRISON & FOERSTER LLP |
| 425 MARKET STREET |
| SAN FRANCISCO, CA 94105-2482 |
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