Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11338439
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Filing Dt:
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01/24/2006
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Publication #:
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Pub Dt:
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02/22/2007
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Inventors:
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Kieran P. Harney, John R. Martin, Lawrence E. Felton
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Title:
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Partially etched leadframe packages having different top and bottom topologies
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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ONE TECHNOLOGY WAY |
NORWOOD, MASSACHUSETTS 02062-9106 |
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BROMBERG & SUNSTEIN LLP |
125 SUMMER STREET |
BOSTON, MA 02110 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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200 RESEARCH DRIVE |
WILMINGTON, MASSACHUSETTS 01887 |
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DAVID J. THIBODEAU, JR. |
HAMILTON BROOK SMITH & REYNOLDS, PC |
530 VIRGINIA ROAD |
CONCORD, MA 01742 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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14-34 110TH STREET |
COLLEGE POINT |
NEW YORK, NEW YORK 11356 |
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WEINGARTEN SCHURGIN GAGNEBIN & LEBOVICI |
TEN POST OFFICE SQUARE |
BOSTON, MA 02109 |
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09/23/2024 06:19 AM
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