Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11162224
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Filing Dt:
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09/01/2005
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Publication #:
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Pub Dt:
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03/01/2007
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Inventor:
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Michael J. Varnau
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Title:
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METHOD OF SOLDER BUMPING A CIRCUIT COMPONENT AND CIRCUIT COMPONENT FORMED THEREBY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| LEGAL STAFF - MAIL CODE: 480-410-202 |
| P.O. BOX 5052 |
| TROY, MICHIGAN 48007-5052 |
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| DELPHI TECHNOLOGIES, INC. |
| M/C 480-410-202 |
| PO BOX 5052 |
| TROY, MI 48007 |
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