Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11306099
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Filing Dt:
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12/16/2005
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Publication #:
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Pub Dt:
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03/01/2007
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Inventors:
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Ya-Yu Hsieh, Wei-Chung Wang, Tzu-Bin Lin
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Title:
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PACKAGE STRUCTURE AND FABRICATION PROCESS THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 26, CHIN 3RD. RD., 811, NANTZE EXPORT PROCESSING ZONE |
| KAOHSIUNG, TAIWAN |
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| JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE |
| 7 FLOOR-1, NO. 100 |
| ROOSEVELT ROAD, SECTION 2 |
| TAIPEI, TAIWAN 100 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 26, CHIN 3RD RD., 811, NANTZE |
| EXPORT PROCESSING ZONE |
| KAOHSIUNG, TAIWAN R.O.C. |
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| JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE |
| 7F-1, NO. 100, ROOSEVELT RD. |
| SEC. 2 |
| TAIPEI 100, TAIWAN, R.O.C. |
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