Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/06/2010
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Application #:
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11360812
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Filing Dt:
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02/24/2006
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Publication #:
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Pub Dt:
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03/01/2007
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Inventors:
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Benlih Huang, Hong-Sik Hwang, Ning-Cheng Lee
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Title:
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TECHNIQUE FOR INCREASING THE COMPLIANCE OF TIN-INDIUM SOLDERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1676 LINCOLN AVENUE |
UTICA, NEW YORK 13502 |
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THOMAS E. ANDERSON |
INTELLECTUAL PROPERTY DEPARTMENT |
HUNTON & WILLIAMS LLP |
1900 K STREET, N.W., SUITE 1200 |
WASHINGTON, DC 20006-1109 |
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