Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11453416
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Filing Dt:
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06/14/2006
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Publication #:
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Pub Dt:
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03/08/2007
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Inventors:
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Jen-Dong Hwang, Jiann-Jong Su, Chih-Jong Chang, Cheng-Chou Wong
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Title:
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Heat dissipation device and composite material with high thermal conductivity
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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195 CHUNG HSING ROAD, SEC. 4, CHUTUNG |
HSINCHU, TAIWAN |
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QUINTERO LAW OFFICE |
1617 BROADWAY, 3RD FLOOR |
SANTA MONICA, CA 90404 |
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