Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11513203
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Filing Dt:
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08/31/2006
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Publication #:
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Pub Dt:
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03/08/2007
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Inventors:
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Kyung-Wook Paik, Ho-Young Son, Myung-Jin Yim
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Title:
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Wafer level chip size package for CMOS image sensor module and manufacturing method thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 373-1 GUSEONG-DONG, DAEJEON |
| YUSEONG-GU, KOREA, REPUBLIC OF 305701 |
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| LEO J. JENNINGS |
| WASHINGTON SQUARE, SUITE 1100 |
| 1050 CONNECTICUT AVENUE, N.W. |
| WASHINGTON, D.C. 20036 |
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