Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10548134
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Filing Dt:
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11/15/2006
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Publication #:
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Pub Dt:
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03/29/2007
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Inventors:
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Dan O. Popa, Byoung Hun Kang, Eric M. Leonard, Harry E. Stephanou, Jian-Qiang Lu et al
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Title:
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Wafer bonding compatible with bulk micro-machining
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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110 8TH STREET |
TROY, NEW YORK 12180-3590 |
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ROBERT M. ABRAHAMSEN |
WOLF, GREENFIELD & SACKS, P.C. |
600 ATLANTIC AVENUE |
BOSTON, MASSACHUSETTS 02210-2206 |
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