Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11520584
|
Filing Dt:
|
09/14/2006
|
|
Publication #:
|
|
Pub Dt:
|
03/29/2007
| | | | |
|
Inventor:
|
Keiji Maeda
|
|
Title:
|
METHOD OF RESIN-SEAL-MOLDING ELECTRONIC COMPONENT AND APPARATUS THEREFOR
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 5, KAMITOBA KAMICHOSHI-CHO, MINAMI-KU |
| KYOTO-SHI KYOTO 601-8105, JAPAN |
|
|
|
|
| CHARLES GORENSTEIN |
| BIRCH, STEWART ET AL |
| 8110 GATEHOUSE ROAD, SUITE 100 EAST |
| P.O. BOX EAST |
| FALLS CHURCH, VA 22040-0747 |
|
|
Search Results as of:
06/20/2024 03:20 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
