Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11472324
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Filing Dt:
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06/22/2006
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Publication #:
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Pub Dt:
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04/12/2007
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Inventors:
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Takeo Shirahama, Shinichi Miyakuni, Toshiaki Kitano, Takahiro Iino et al
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Title:
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Method for manufacturing a compound semiconductor device having an improved via hole
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-3, MARUNOUCHI 2-CHOME |
| CHIYODA-KU |
| TOKYO, JAPAN 100-8310 |
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| JEFFREY A. WYAND |
| LEYDIG, VOIT & MAYER |
| 700 THIRTEENTH ST., N.W. SUITE 300 |
| WASHINGTON, D.C. 20005-3960 |
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