Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11243809
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Filing Dt:
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10/05/2005
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Publication #:
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Pub Dt:
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04/26/2007
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Inventors:
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Sung-won Moon, Devendra Natekar, Chia-pin Chiu
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Title:
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Stacked die package with thermally conductive block embedded in substrate
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2200 MISSION COLLEGE BOULEVARD |
M/S SC4-202 |
SANTA CLARA, CALIFORNIA 95052-5326 |
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KERRY D. TWEET |
2200 MISSION COLLEGE BLVD., M/S SC4-202 |
P.O. BOX 5326 |
SANTA CLARA, CALIFORNIA 95056-5326 |
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