Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
11525813
|
Filing Dt:
|
09/25/2006
|
|
Publication #:
|
|
Pub Dt:
|
05/17/2007
| | | | |
|
Inventors:
|
Tsutomu Nakada, Makoto Kubota
|
|
Title:
|
Layer forming method, layer forming apparatus, workpiece processing apparatus, interconnect forming method, and substrate interconnect structure
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 11-1, HANEDA ASAHI-CHO |
| OHTA-KU, TOKYO, JAPAN |
|
|
|
|
| C. IRVIN MCCLELLAND |
| OBLON, SPIVAK, MCCLELLAND, MAIER & NEUST |
| 1940 DUKE STREET |
| ALEXANDRIA, VA 22314 |
|
|
Search Results as of:
05/02/2024 11:00 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
