Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11603027
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Filing Dt:
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11/22/2006
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Publication #:
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Pub Dt:
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05/31/2007
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Inventors:
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Hung-Der Su, Chih-Ping Tan, Yu-Che Lin, Yuh-Chyuan Wang, Chao-Kang Ho
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Title:
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Circuit under pad structure and bonding pad process
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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5F, NO. 20, TAI YUEN STREET, CHUPEI CITY |
HSINCHU, TAIWAN R.O.C. |
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ROSENBERG, KLEIN & LEE |
3458 ELLICOTT CENTER DRIVE-SUITE 101 |
ELLICOTT CITY, MD 21043 |
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