Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11373531
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Filing Dt:
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03/09/2006
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Publication #:
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Pub Dt:
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06/07/2007
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Inventor:
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Chun-Hung Lin
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Title:
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Chip package structure
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 1, R&D 1ST RD. |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN R.O.C. |
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| CANON'S COURT, 22 VICTORIA STREET |
| HAMILTON HM12, BERMUDA |
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| J.C. PATENTS, INC. |
| 4 VENTURE, SUITE 250 |
| IRVINE, CALIFORNIA 92618 |
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