Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/27/2014
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Application #:
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11297722
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Filing Dt:
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12/08/2005
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Publication #:
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Pub Dt:
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06/14/2007
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Inventors:
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Mukul Renavikar, Susheel G. Jadhav
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Title:
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SOLDER DEPOSITION AND THERMAL PROCESSING OF THIN-DIE THERMAL INTERFACE MATERIAL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BLVD. |
| SANTA CLARA, CALIFORNIA 95052 |
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| ANN M. MCCRACKIN |
| SCHWEGMAN, LUNDBERG, WOESSNER & KLUTH |
| P.O. BOX 2938 |
| MINNEAPOLIS, MN 55402 |
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