Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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07/22/2008
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Application #:
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11314272
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Filing Dt:
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12/21/2005
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Publication #:
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Pub Dt:
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06/21/2007
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Inventors:
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Vincenzo Condorelli, Claudius Feger, Kevin C. Gotze, Edmund J. Sprogis, Nihad Hadzic et al
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Title:
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PHYSICALLY HIGHLY SECURE MULTI-CHIP ASSEMBLY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| STEPHEN BONGINI |
| FLEIT, KAIN, GIBBONS, GUTMAN, ET AL |
| ONE BOCA COMMERCE CENTER |
| 551 NORTHWEST 77TH STREET, SUITE 111 |
| BOCA RATON, FLORIDA 33487 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| PO. BOX 31119 GRAND PAVILION, HIBISCUS WAY, 802 WEST BAY ROAD |
| GRAND CAYMAN, CAYMAN ISLANDS KY1-1205 |
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| JIANPING ZHANG |
| SEED IP LAW GROUP LLP |
| 701 FIFTH AVENUE, SUITE 5400 |
| SEATTLE, WA 98104 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 13D-3-3, BUILDING B, FLOOR 13, NO. 28 |
| XINYI ROAD, HAIDIAN DISTRICT |
| BEIJING, CHINA |
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| SEED IP LAW GROUP |
| 701 5TH AVE |
| STE 5400 |
| SEATTLE, WA 98104 |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 0207, 2/F, BUILDING 4, ZIJIN DIGITAL PARK |
| HAIDIAN DISTRICT |
| BEIJING, CHINA 100190 |
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| SEED IP LAW GROUP LLP |
| 701 5TH AVENUE |
| SUITE 5400 |
| SEATTLE, WA 98104 |
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