Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11308519
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Filing Dt:
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03/31/2006
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Publication #:
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Pub Dt:
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06/28/2007
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Inventor:
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Chih-Kuang Yang
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Title:
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SUBSTRATE WITH MULTI-LAYER INTERCONNECTION STRUCTURE AND METHOD OF MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 6, CREATION 4TH ROAD |
SCIENCE-BASED INDUSTRIAL PARK |
HSINCHU, TAIWAN |
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PAI PATENT & TRADEMARK LAW FIRM |
1001 FOURTH AVENUE, SUITE 3200 |
SEATTLE, WA 98154 |
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