Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11644837
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Filing Dt:
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12/26/2006
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Publication #:
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Pub Dt:
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06/28/2007
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Inventor:
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Jung Joo Kim
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Title:
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Multi-layered metal wiring structure of semiconductor device and manufacturing method thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 891-10 DAECHI-DONG, GANGNAM-GU |
| SEOUL, KOREA, REPUBLIC OF |
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| MAYER, BROWN, ROWE & MAW LLP |
| 1909 K STREET, N.W. |
| WASHINGTON, DC 20006 |
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