Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/22/2009
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Application #:
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11616288
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Filing Dt:
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12/27/2006
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Publication #:
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Pub Dt:
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07/05/2007
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Inventor:
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Chien-Hao Wang
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Title:
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THERMALLY ENHANCED CORELESS THIN SUBSTRATE WITH EMBEDDED CHIP AND METHOD FOR MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 26, CHIN 3RD. RD., 811, NANTZE EXPORT PROCESSING ZONE |
| KAOHSIUNG, TAIWAN |
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| JIANQ CHYUN INTELLECTUAL PROPERTY |
| 7F.-1, NO. 100, ROOSEVELT RD., SEC. 2, |
| TAIPEI, 100 TAIWAN |
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