Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/14/2008
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Application #:
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11608112
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Filing Dt:
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12/07/2006
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Publication #:
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Pub Dt:
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07/12/2007
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Inventor:
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CHIEN-HAO WANG
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Title:
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MULTI-CHIP BUILD-UP PACKAGE OF OPTOELECTRONIC CHIP
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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26, CHIN 3RD RD., 811, NANTZE EXPORT PROCESSING ZONE |
KAOHSIUNG, TAIWAN R.O.C. |
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J. C. PATENTS |
4 VENTURE, SUITE 250 |
IRVINE, CA 92618 |
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