Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11324453
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Filing Dt:
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01/03/2006
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Publication #:
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Pub Dt:
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07/19/2007
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Inventors:
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Young-Gon Kim, David Gibson, Michael Warner, Philip Damberg, Philip R. Osborn
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Title:
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Components, methods and assemblies for multi-chip packages
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3099 ORCHARD DRIVE |
| SAN JOSE, CALIFORNIA 95134 |
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| TESSERA |
| LERNER DAVID ET AL. |
| 600 SOUTH AVENUE WEST |
| WESTFIELD, NJ 07090 |
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