Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11468341
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Filing Dt:
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08/30/2006
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Publication #:
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Pub Dt:
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07/26/2007
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Inventors:
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Yao-Sheng Lin, Tai-Hong Chen
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Title:
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CIRCUIT SUBSTRATE AND PACKAGING THEREOF AND THE METHOD FOR FABRICATING THE PACKAGING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 195, SEC. 4, CHUNG-HSING RD., CHUTUNG CHEN |
HSINCHU HSIEN, TAIWAN |
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MIKIO ISHIMARU |
THE LAW OFFICES OF MIKIO ISHIMARU |
333 W. EL CAMINO REAL, SUITE # 330 |
SUNNYVALE, CA 94087 |
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