Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11702311
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Filing Dt:
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02/06/2007
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Publication #:
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Pub Dt:
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08/09/2007
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Inventors:
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Jung-Tang Huang, Pen-Shan Chao, Hou-Jun Hsu
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Title:
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Method of fabrication on high coplanarity of copper pillar for flip chip packaging application
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5F., NO. 7, LANE 10, SEC. 2, BADE RD. |
| TAIPEI CITY, TAIWAN 106, R.O.C. |
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| JUNG-TANG HUANG |
| 5F., NO. 7, LANE 10, SEC. 2 BADE RD. |
| TAIPEI CITY, TAIWAN 106 |
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