Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/19/2009
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Application #:
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11548066
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Filing Dt:
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10/10/2006
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Publication #:
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Pub Dt:
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08/16/2007
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Inventors:
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Michael Bauer, Kai Chong Chan
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Title:
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SEMICONDUCTOR COMPONENT WITH SEMICONDUCTOR CHIP AND ADHESIVE FILM, AND METHOD FOR ITS PRODUCTION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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ST.-MARTIN-STR. 53 |
MUNICH, GERMANY 81669 |
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STEVEN E. DICKE |
FIFTH ST. TOWERS, 100 SOUTH FIFTH ST. |
SUITE 2250 |
MINNEAPOLIS, MN 55402 |
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