Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11368316
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Filing Dt:
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03/03/2006
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Publication #:
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Pub Dt:
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09/06/2007
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Inventors:
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James Jian-Qiang Lu, J. Jay McMahon, Ronald J. Gutmann
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Title:
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Wafer bonding of damascene-patterned metal/adhesive redistribution layers
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| CII-4011 |
| TROY, NEW YORK 12180 |
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| TONYA S. DRAKE |
| FISH & RICHARDSON P.C. |
| P.O.BOX 1022 |
| MINNEAPOLIS, MN 55440-1022 |
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