Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/12/2009
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Application #:
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11394007
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Filing Dt:
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03/30/2006
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Publication #:
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Pub Dt:
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10/04/2007
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Inventors:
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Bruno Michel, Thomas J. Brunschwiler, Ryan J. Linderman, Urs Kloter, Hugo E. Rothuizen
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Title:
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SEMICONDUCTOR CHIP ASSEMBLY WITH FLEXIBLE METAL CANTILEVERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| INTERNATIONAL BUSINESS MACHINES CORP |
| ROUTE 134/1101 KITCHAWAN RD, BOX 218 |
| YORKTOWN HEIGHTS, NY 10598 |
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