Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11279754
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Filing Dt:
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04/14/2006
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Publication #:
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Pub Dt:
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10/18/2007
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Inventors:
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Ching-Wen Teng, Chin-Kun Lin, Yu-Hsiang Tseng, Boon-Tiong Neo
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Title:
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METHOD OF CLEANING POST-CMP WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU CITY, TAIWAN |
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| WINSTON HSU |
| P.O.BOX 506 |
| MERRIFIELD, VA 22116 |
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