Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11730965
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Filing Dt:
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04/05/2007
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Publication #:
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Pub Dt:
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10/18/2007
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Inventors:
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Kyung Taeg Han, In Tae Yeo, Hun Joo Hahm, Chang Ho Song, Seong Yeon Han, Yoon Sung Na et al
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Title:
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Light emitting diode package and fabrication method thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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314, MAETAN3-DONG, YEONGTONG-GU |
SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF |
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MCDERMOTT WILL & EMERY LLP |
600 13TH STREET, N.W. |
WASHINGTON, D.C. 20005-3096 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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314 MAETAN 3-DONG, YEONGTONG-GU, SUWON, |
GYUNGGI-DO, KOREA, REPUBLIC OF |
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MCDERMOTT WILL & EMERY LLP |
600 THIRTEENTH STREET, N.W. |
WASHINGTON, DC 20005-3096 |
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Assignment:
3
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MERGER (SEE DOCUMENT FOR DETAILS).
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(MAETAN-DONG) 129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, |
SEOUL, KOREA, REPUBLIC OF |
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MCDERMOTT WILL & EMERY LLP |
600 13TH STREET, N.W. |
WASHINGTON, DC 20005-3096 |
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