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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
11636975
Filing Dt:
12/12/2006
Publication #:
Pub Dt:
11/01/2007
Inventors:
Po-Ching Su, Cheng-Yin Lee, Ying-Tsai Yeh, Gwo-Liang Weng
Title:
Stackable semiconductor package
Assignment: 1
Reel/Frame:
018671/0407Recorded: 12/12/2006Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/01/2006
Exec Dt:
12/01/2006
Exec Dt:
12/01/2006
Exec Dt:
12/01/2006
Assignee:
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE
KAOHSIUNG, TAIWAN R.O.C.
Correspondent:
ANDREW J. TELESZ, JR.
VOLENTINE FRANCOS & WHITT, P.L.L.C.
11951 FREEDOM DRIVE, SUITE 1260
RESTON, VA 20190

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