Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11744096
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Filing Dt:
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05/03/2007
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Publication #:
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Pub Dt:
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11/08/2007
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Inventors:
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Kyung-Wook Paik, Ho-Young Son
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Title:
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METHOD FOR MANUFACTURING WAFER-LEVEL PACKAGES FOR FLIP CHIPS CAPABLE OF PREVENTING ADHESIVES FROM ABSORBING WATER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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373-1, GUSEONG-DONG, YUSEONG-KU |
DAEJEON, KOREA, REPUBLIC OF 305-701 |
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CRAIG METCALF |
2795 EAST COTTONWOOD PARKWAY |
SUITE 155 |
SALT LAKE CITY, UT 84121 |
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