Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11664586
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Filing Dt:
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04/04/2007
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Publication #:
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Pub Dt:
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11/15/2007
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Inventors:
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Shinichi Okada, Yoshitaka Sugawara, Katsunori Asano, Daisuke Takayama et al
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Title:
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High Withstand Voltage Semiconductor Device Covered with Resin and Manufacturing Method Therefor
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6-16, NAKANOSHIMA 3-CHOME, KITA-KU |
| OSAKA-SHI, OSAKA, JAPAN 530-8270 |
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| 2-35, HIGASHI-OGU 7-CHOME, ARAKAWA-KU |
| TOKYO, JAPAN 116-0012 |
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| H. WARREN BURNAM, JR. |
| NIXON & VANDERHYE P.C. |
| 901 NORTH GLEBE ROAD |
| 11TH FLOOR |
| ARLINGTON, VA 22203 |
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