Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11543052
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Filing Dt:
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10/05/2006
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Publication #:
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Pub Dt:
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11/22/2007
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Inventors:
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I-Hsin Mao, Ya-Chi Chen, Chun-Ying Lin, Yu-Ren Chen
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Title:
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Integrated circuit package and multi-layer lead frame utilized
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| CANON'S COURT, 22 VICTORIA STREET |
| HAMILTON HM 12, BERMUDA |
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| NO. 1. R&D RD. 1, SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN R.O.C. |
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| TROXELL LAW OFFICE PLLC |
| 5205 LEESBURG PIKE |
| SUITE 1404 |
| FALLS CHURCH, VIRGINIA 22041-3401 |
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