Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11583167
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Filing Dt:
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10/19/2006
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Publication #:
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Pub Dt:
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11/29/2007
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Inventors:
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Te-Hai Tseng, Jin-Shr Huang
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Title:
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Packaging structure
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 1, LI-HSIN 2ND ROAD |
SCIENCE-BASED INDUSTRIAL PARK |
HSINCHU, TAIWAN R.O.C. |
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ROBERT H. BERDO, JR. |
RABIN & BERDO, PC |
1101 14TH ST. NW |
SUITE 500 |
WASHINGTON, DC 20005 |
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