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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10551195
Filing Dt:
04/27/2007
Publication #:
Pub Dt:
11/29/2007
Inventor:
Seiichi Nagata
Title:
Silicon Substrate and Method of Forming the Same
Assignment: 1
Reel/Frame:
018302/0690Recorded: 09/13/2006Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/30/2005
Assignees:
1126-1, ICHINO-CHO
HAMAMATSU-SHI, SHIZUOKA 435-8558, JAPAN
B-6 MEZON TAKEUCHI 2, 341 KOMATSU
HAMAMTSU-SHI, SHIZUOKA 434-0042, JAPAN
Correspondent:
DRINKER BIDDLE & REATH (DC)
1500 K STREET, N.W.
SUITE 1100
WASHINGTON, DC 20005-1209

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