skip navigationU S P T O SealUnited States Patent and Trademark Office AOTW logo
Home|Site Index|Search|Guides|Contacts|eBusiness|eBiz alerts|News|Help
Assignments on the Web > Patent Query
Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
11807425
Filing Dt:
05/29/2007
Publication #:
Pub Dt:
12/06/2007
Inventors:
Daigo Suzuki, Hidenori Tanaka, Jun Karasawa
Title:
Component-embedded printed wiring board, manufacturing method for component-embedded printed wiring board, and electronic apparatus
Assignment: 1
Reel/Frame:
019716/0828Recorded: 08/16/2007Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/13/2007
Exec Dt:
06/14/2007
Exec Dt:
06/20/2007
Assignee:
1-1, SHIBAURA 1-CHOME, MINATO-KU
TOKYO, JAPAN 105-8001
Correspondent:
KNOBBE MARTENS OLSON & BEAR LLP
2040 MAIN STREET
FOURTEENTH FLOOR
IRVINE, CA 92614

Search Results as of: 04/25/2024 11:11 PM
If you have any comments or questions concerning the data displayed, contact PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified: August 25, 2017 v.2.6
| .HOME | INDEX| SEARCH | eBUSINESS | CONTACT US | PRIVACY STATEMENT