Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11591800
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Filing Dt:
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11/01/2006
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Publication #:
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Pub Dt:
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12/06/2007
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Inventors:
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Cheng-Yi Chang, Chien-Ping Huang, Chih-Ming Huang, Chieh-Yuan Lin, Cheng-Hsu Hsiao
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Title:
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Semiconductor package and method for fabricating the same
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 123, SEC. 3, DA FONG RD., TANTZU |
TAICHUNG, TAIWAN ROC |
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PETER F. CORLESS |
EDWARDS ANGELL PALMER & DODGE LLP |
P.O. BOX 55874 |
BOSTON, MA 02205 |
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