Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11604756
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Filing Dt:
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11/28/2006
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Publication #:
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Pub Dt:
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12/06/2007
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Inventors:
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Jinn P. Chu, Chon-Hsin Lin
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Title:
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Copper layer and a method for manufacturing said copper layer
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 2, PEI-NING RD. |
KEELUNG, TAIWAN ROC |
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STEVEN M. RABIN |
RABIN & BERDO, PC |
1101 14TH ST., NW |
SUITE 500 |
WASHINGTON, DC 20005 |
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